Thermal Shock Testing
Thermal shock testing is used to examine the effect of very rapid temperature changes on a product. A typical part of an environmental stress screening program on electronic systems, where the differing coefficients of thermal expansion create high stresses at the interface between the different materials.
The two-zone thermal shock testing chamber moves the product under test between two separate chambers using an automatic elevator. Each chamber is set to either of the temperature extremes. Very rapid product temperature changes on the order of just seconds are possible. Liquid nitrogen can also be used to provide the highest rate of cooling.
Temperature Range: -70°C to +200°C
Transition Between Temperatures: Typically a few seconds
Largest Inside Dimensions: 0.38m L x 0.64m W x 0.38m H
Door Opening: 0.64m W x 0.38m H
- MIL-STD-202G Method 106G
- MIL-STD-810G Method 503.5